India’s push to build a strong semiconductor ecosystem has taken a fresh step forward, with Odisha entering the spotlight in a big way. The country has now moved closer to developing advanced chip-making capabilities, not by manufacturing chips directly, but by focusing on a critical stage that often decides performance – packaging. In a development that hints at both technological progress and policy intent, the foundation stone for India’s first advanced 3D chip packaging facility has been laid in Bhubaneswar.
The project, coming up at Info Valley in Odisha’s Khordha district, is being set up by US-based 3D Glass Solutions through its Indian arm, Heterogeneous Integration Packaging Solutions Pvt Ltd. What makes this facility stand out is the involvement of global players like Intel, which is supporting the initiative, highlighting growing international interest in India’s semiconductor plans.
At the ceremony, Chief Minister Mohan Charan Majhi called the project a “historic milestone” for both Odisha and the country. He pointed out that this is the first time such an advanced 3D glass-based semiconductor packaging unit is being established in India. According to him, the participation of global technology firms shows increasing confidence in the state’s industrial capabilities.
Unlike traditional chip manufacturing, this facility will focus on advanced packaging, a stage where chips are assembled and prepared for real-world use. The technology being deployed uses specialised glass substrates instead of silicon, allowing better performance, improved thermal stability, and lower electrical losses. This becomes especially important for next-generation applications like AI, high-performance computing, telecom, and defence electronics.
The scale of the project also shows its ambition. With an investment of nearly Rs 2,000 crore, the plant is expected to produce around 70,000 glass panels every year, along with 50 million assembled semiconductor units and about 13,000 advanced 3D integration modules. Once operational, the facility will cater to sectors such as data centres, 5G and 6G communications, automotive radar systems, aerospace, and photonics.
Union Minister Ashwini Vaishnaw described the initiative as one of the most advanced manufacturing projects of its kind in India. He said the country’s semiconductor ecosystem is expanding quickly under the government’s push, with Odisha emerging as a new hub. He also highlighted that India’s electronics manufacturing output has grown significantly over the past decade, with the country now among the leading mobile phone producers globally.
The project is part of the bigger India Semiconductor Mission, under which multiple proposals have already been approved. Odisha alone has secured two such projects so far, with more in discussion, including potential future investments involving companies like Intel.
Beyond technology, the project is also expected to bring economic benefits. The state government believes it will generate around 2,500 direct and indirect jobs, creating opportunities for engineers, diploma holders, and ITI graduates. Officials say this could gradually shift Odisha’s identity from a resource-driven economy to a technology-led one.
Commercial production at the plant is expected to begin by August 2028, with full-scale operations targeted by 2030. By then, India could have a stronger presence in the global semiconductor value chain, not just as a consumer market, but as a key contributor to advanced electronics manufacturing.
